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Printed circuit boards (PCBs) are key performance drivers of electronic circuits. However, the performance of the circuit board depends on its layout structure. PCB layout is nothing but an arrangement of diverse components that improve efficiency, as well as stability of the PCB. Over the past few years, using an array of PCBs has gained immense popularity. Among others, Ball Grid Array (abbreviated as BGA) has been widely used owing to its beneficial features. BGA is used in circuit boards that demand high-density connections. Would you like to know how BGA became the first choice of OEMs or what are the cons of these techniques? This post focuses on both the pros and cons of this technology.What are the Benefits of Using Ball Grid Arrays
The following important advantages of BGA, which makes them popular among others:
Nowadays, various electronic applications demand miniature packages with several pins. Owing to this reason, the Pin Grid Array (PGA) and dual-in-line surface mount (SOIC) packages were introduced that offer lower track densities. However, PCB manufacturers faced many issues, and bridging of pins is one of them. BGA overcomes this issue, as solder balls offer the appropriate soldering required for holding the package. These solder balls are placed close to one another; this strengthens the interconnections and reduces the footprint of the PCB. High-density connections by BGA components makes effective use of the area on the PCB.
The pins used in the PGA packages are thin and fragile. Thus, these pins are easily damaged or bent. However, this does not happen with BGA packages. In BGA, solder pads are connected to solder balls that make the system more reliable.
In BGA, the solder balls are placed near to each other, which enables a close bond among components, strengthens interconnections, and reduce signal distortions during high-speed work. This means the system offers higher electrical performance at high speeds.
Unlike PGA, the solder balls of BGA are melted by the heating process, which allows them to adhere to the circuit board. This helps in reducing the chances of component damage.
BGA packages involve many thermal channels that take out the heat in the integrated circuit boards. This significantly reduces the chances of overheating.
Like other electronic applications, BGAs also have drawbacks. Following are some of them:
A BGA is nothing but a small piece of material on which the manufacturer places an integrated circuit die. As the BGAs are tiny in size, it is difficult to inspect the solder joints through visual observation. However, this problem can be solved using special microscopes and X-ray machines.
Due to the flexural stress from the circuit boards, BGAs are prone to stress that lead to reliability issues.
The equipment required for the soldering of BGA packages is highly expensive. Due to this, BGA packages are expensive. Additionally, hand-soldering is used for the smallest packages in extremely small quantities.
All the mentioned beneficial features contribute to the wide use of BGAs. Thus, the demand for BGA packages is high. Although BGA devices operate using advanced technology, they are vulnerable to failures. One of the biggest problem faced by these devices is solder joint failure. Hence, it is important to inspect every single joint to reduce the rework process. Are you planning to consider BGA for your upcoming project? If yes, then it is important that you source them from an industry-leading, trustworthy, and reliable manufacture like Creative Hi-Tech. The company offers a wide range of BGA packages in customized specifications.
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