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Over the years, various printed circuit board technologies have gained popularity. Ball Grid Array (BGA) is one such technology, which has attained immense following in the recent years. This technology is employed for circuit boards that demand high-density connections. Are you eager to know what makes this technology popular? This post discusses various BGA packages and their advantages in detail.
BGA is a surface mount technology, which was devised for large integrated circuits with a large number of pins. In conventional QFP or quad packages, pins are placed close to each other. These pins can easily get damaged at slightest irritation. Additionally, these pins demanded tight control on soldering, otherwise, the joints and solder bridges would collapse. From a design point of view, the high pin density caused various problems, and it was difficult to take the tracks away from IC due to congestion in some areas. The BGA package was developed to overcome these issues. A Ball Grid Array has a different approach to the connections than regular surface mount connections. Unlike them, this package utilizes the underside area for connections. Also, the pins are arranged in a grid pattern on the underside of the carrier for a chip. Instead of pins providing the connectivity, the pads with solder balls provide the connection. The printed circuit board is equipped with a set of copper pads for integrating these ball array packages.
The following are important types of BGA packages developed to meet diverse assembly requirements:
All these BGA Assembly packages are designed for complex circuit boards. In the next post, we will discuss several advantages of these BGA packages.