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BGA PCB Assembly

Ball Grid Array (BGA) assembly is a type of surface mount technology, which is used for integrated circuits. Creative Hi-tech Ltd. (CHTL) is one of the leading BGA assembly service providers in USA.

BGA Capabilities

Our capabilities in BGA assembly are as follows:

Types (based on size)

Micro BGAs (2mmX3mm) Large size BGAs (45 mm)

Types (based on material)

Ceramic BGAs Plastic BGAs

Minimum Pitch
0.4 mm

BGA soldering BGA rework 


BGA Assembly Testing Procedure

The X-ray inspection method is widely used for testing BGA assembly. This helps identify various soldering defects like melting of balls holding connections, paste bridging, damaged connections, etc. Besides this, the X-ray support software is capable of calculating the gap size in the ball, to ensure that it follows the IPC Class II standard.

Our experienced technicians can use 2D X-rays for rendering 3D images. This helps to identify inner problems such as cold soldering of BGA balls, damaged Via’s in inner layers.

BGA Advantages

The ball grid assembly provides various advantages, and are becoming integral part of electronic circuits.

  • Improved Manufacturing: 

    BGA assembly helps improve soldering, which further improves manufacturing yields. Ball grid arrays feature wide spacing between connections, which also improves the solderability.

  • ‚ÄčNo Pin Bridging: 

    BGAs are used in miniature packages for ICs having hundreds of pins. As a BGA improves solderability, there are lesser or no chances of adjacent pins bridging together when the solder is applied.

  • Efficient Use of Space: 

    BGAs allow efficient use of space on a printed circuit board. This helps add connections around the edges, as well as under the SMD package.

  • Low-inductance Leads: 

    Ball grid arrays have very short space between the PCB and package. They have low inductances and so, have superior electrical performance to leaded devices.

  • Heat Conduction:

    Ball grid array packages with distinct leads have lesser resistance to heat between the PCB and the package. This lets the heat generated by an IC inside the package to flow more effortlessly to the PCB. This protects the chip from getting overheated.

Industries Served

With the capabilities mentioned in the table above, it has helped us to serve a wide range of industries varying from:

  • Aerospace and Satellite
  • LED Industry
  • Medical industries
  • Wireless, military, and telecommunications industries.  


The skilled technicians and engineers work with you to understand your product requirements and deliver a product that best suits your application requirements. We follow all the required industry standards such as:  
  • IPC-WHMA-A-610 Compliant
  • IPC-CC-830B Compliant

You can contact us for any queries about our BGA Assembly services. Feel free to call us at 224-653-4000, or email at sales@creativehitech.com. We will get back to you within one business day.

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