Equipment List

Fuji CP-643 Chip Shooter

• Placement at 40,000 CPH
• 0201 Capable
• Vision System
• 0.1 mil Accuracy

Line Set Up 1

• Continuous Flow with no Intervention
• Screen Print through Reflow
• Low pin count and passives on Fuji
• High pin count, trays, and all components on JUKI 2060E
• Vitronics Soltec XPM2 Reflow Oven
• RoHs and Non-RoHS Wave Solder

Line Set Up 2

• Continuous Flow with no Intervention for Prototype

Line Set Up 3

• Manual Assembly Line
• Speedline Electrovert VectraElite Wave Soldering

Nu Clean Poly SMT 318 XL

• Our water soluble cleaning system assures contamination-free assemblies

X-RAY Inspection Station

• Glenn Brook RTX-113 System
• Laminographic Imaging

Bandit APE Rework Station

• BGA
• Micro BGA
• Fine Pitch QFP

Inspection:
Orbotech Symbian S-36

• Multiple cameras with 3D image acquisition & processing

Component Placement Speeds:

• Fuji - 40,000/Hr.
• Juki - 12,500/Hr.

Component Placement Accuracy :

• Fuji - ±0.1mm
• Juki - ±30µm (3 Sigma)